Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation
International Journal of Food Studies, cilt.7, sa.1, ss.13-23, 2018 (Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 7 Sayı: 1
- Basım Tarihi: 2018
- Doi Numarası: 10.7455/ijfs/7.1.2018.a2
- Dergi Adı: International Journal of Food Studies
- Derginin Tarandığı İndeksler: Scopus
- Sayfa Sayıları: ss.13-23
- Anahtar Kelimeler: Acoustic, Crispness, Texture, Wafer
- Açık Arşiv Koleksiyonu: AVESİS Açık Erişim Koleksiyonu
- Hatay Mustafa Kemal Üniversitesi Adresli: Evet
Özet
The purpose of this study was to investigate optimum test conditions of acoustical-mechanical mea- surement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Force- displacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters \maximum sound pres- sure", 'total count peaks" and 'mean sound value" were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the number of peaks of the force and acoustic signal decreased with increasing distance and test speed.