Examination of optimum test conditions for a 3-point bending and cutting test to evaluate sound emission of wafer during deformation
International Journal of Food Studies, vol.7, no.1, pp.13-23, 2018 (Scopus)
- Publication Type: Article / Article
- Volume: 7 Issue: 1
- Publication Date: 2018
- Doi Number: 10.7455/ijfs/7.1.2018.a2
- Journal Name: International Journal of Food Studies
- Journal Indexes: Scopus
- Page Numbers: pp.13-23
- Keywords: Acoustic, Crispness, Texture, Wafer
- Open Archive Collection: AVESIS Open Access Collection
- Hatay Mustafa Kemal University Affiliated: Yes
Abstract
The purpose of this study was to investigate optimum test conditions of acoustical-mechanical mea- surement of wafer analysed by Acoustic Envelope Detector attached to the Texture Analyser. Force- displacement and acoustic signals were simultaneously recorded applying two different methods (3-point bending and cutting test). In order to study acoustical-mechanical behaviour of wafers, the parameters \maximum sound pres- sure", 'total count peaks" and 'mean sound value" were used and optimal test conditions of microphone position and test speed were examined. With a microphone position of 45° angle and 1 cm distance and at a low test speed of 0.5 mm/s wafers of different quality could be distinguished best. The angle of microphone did not have significant effect on acoustic results and the number of peaks of the force and acoustic signal decreased with increasing distance and test speed.